Communication PCBA — Switch, Optical Module and 5G/IoT Baseboards

Communication equipment lives on signal speed and integrity. Every gigabit of throughput depends on controlled impedance, matched trace lengths and clean power planes. XUNFEI builds high-layer-count boards with controlled impedance and high-speed materials so signals stay clean at multi-gigabit rates.

We produce switch PCBs, optical modules, base station boards, gateways, firewalls, routers, RF communication boards and IoT module baseboards for 4G/5G, LoRa and NB-IoT. HDI with blind and buried vias supports the dense BGA packages typical of modern communication SoCs.

A circuit board's quality and performance directly shape how well the whole system runs. Our engineers control signal routing, heat dissipation and anti-interference from the first drawing, while our mature high-multilayer and HDI board manufacturing capabilities — backed by strict quality control — ensure consistent quality and high reliability from prototype to volume production.

From board to network: our switch and module boards are integrated into finished network equipment such as this rackmount switch, carrying traffic around the clock in data centers and enterprises.